On the Altium design files for the imp003, which includes the antenna trace, external components, etc. I noticed that all the vias are tented on top and bottom. Our current fab house doesn’t support via tenting. I didn’t find any notes about this in the datasheet, so is this a required feature or can we use the imp003 without via tenting?
Tenting them (ie covering with soldermask) is pretty common. If you don’t do this then you are at a higher risk of solder shorts especially for those under the module.
There aren’t any vias on the antenna trace though?