We’re going to give your approach a go with tacky flux and solder spheres. We’re using a 4 layer 1.6mm SEEED PCB which apparently is quite difficult to work with as the component pads without thermal relief on high current paths and the large ground planes wick away heat, making soldering difficult. Do you see any problem with loading just the IMP with flux and reflowing just the IMP to get consistent solder on it’s pads then placing it on a similarly prepared PCB with plenty of flux?
Coincidentally my PCB guy has a T962 too, with mods. Any tips on soldering profile with the SEEED 1.6mm PCB?
Ah, ok. What if the SPI flash dies - the user will be none the wiser?